Electronic components (MLCC·Connectors)

Neurocle's vision inspection precisely detects defects that were difficult to distinguish using rule-based methods, from micro defects in ultra-small components to irregular display panel defects. This delivers consistent judgment criteria, minimizing over-detection and under-detection to maximize yield.



















Precisely inspects internal defects, micro-pin plating conditions, and bond application to prevent defects from carrying over to later processes.
Detects micron-scale defects at the earliest stages of the process, preventing defect propagation to downstream operations
Precisely distinguishes everything from FPCB surface defects to PCB chip identification, improving judgment accuracy and ensuring quality consistency.
Precisely identifies micron-level defects arising in the early stages of the process, helping prevent defect propagation to downstream processes.
Precisely detects key defects across the process, including Mura, minimizing both under-detection and over-detection.
Accurately identify defects and microcracks using high-resolution imaging, improving yield while minimizing both overkill and underkill.





7F, 30, Godeokbizvalley-ro 4-gil, Gangdong-gu, Seoul, 05203, Korea
+82-2-6952-6897
info@neuro-cle.com
+82-2-6952-6898
neurocle@neuro-cle.com


7F, 30, Godeokbizvalley-ro 4-gil, Gangdong-gu, Seoul, 05203, Korea
+82-2-6952-6897
info@neuro-cle.com
+82-2-6952-6898
neurocle@neuro-cle.com
