Semiconductor vision inspection for minimized underkill and overkill


Semiconductor Vision Inspection Minimizing Underkill and Overkill


Neurocle’s vision inspection solution precisely detects even subtle defects in semiconductor processes, such as fine scratches, stains, and pattern abnormalities which are difficult to identify with the naked eye. This helps reduce overkill while reliably screening out true defects that could otherwise lead to underkill.

seconductor ai vision inspection

Neurocle's
solution clients

Neurocle's solution clients

Fields of application

Applications from wafer manufacturing to packaging

Wafer manufacturing

Ceramic component surface inspection

Wafer edge length measurement

Wafer manufacturing

Ceramic component surface inspection

Wafer edge length measurement

Patterning

Pattern defect inspection

Wafer pattern surface inspection

Patterning

Pattern defect inspection

Wafer pattern surface inspection

Packaging

Chip pattern defect detection

Solder bump defect inspection

Between-chip scribe line inspection

Wafer surface secondary inspection

Packaging

Chip pattern defect detection

Solder bump defect inspection

Between-chip scribe line inspection

Wafer surface secondary inspection

Wafer manufacturing

Ceramic component surface inspection

Wafer edge length measurement

Patterning

Pattern defect inspection

Wafer pattern surface inspection

Packaging

Chip pattern defect detection

Solder bump defect inspection

Between-chip scribe line inspection

Wafer surface secondary inspection

Use case

Use cases in semiconductor manufacturing

Wafer manufacturing

Detects micron-scale defects at the earliest stages of the process, preventing defect propagation to downstream operations

Wafer manufacturing

Detects micron-scale defects at the earliest stages of the process, preventing defect propagation to downstream operations

seconductor ai vision inspection

Ceramic component surface inspection

Detects fine defects (dark / white spots) on ceramic component surfaces

seconductor ai vision inspection

Wafer edge length measurement

Distinguishes wafer edge sections and measures their lengths.

seconductor ai vision inspection

Ceramic component surface inspection

Detects fine defects (dark / white spots) on ceramic component surfaces

seconductor ai vision inspection

Wafer edge length measurement

Distinguishes wafer edge sections and measures their lengths.

Patterning

Precisely identifies micron-level defects arising in the early stages of the process, helping prevent defect propagation to downstream processes.

Patterning

Precisely identifies micron-level defects arising in the early stages of the process, helping prevent defect propagation to downstream processes.

seconductor ai vision inspection

Pattern defect inspection

Precisely detects fine pattern defects generated during the photolithography process using deep learning vision inspection.

seconductor ai vision inspection

Wafer surface defect inspection

Identifies defect areas on the wafer surface to determine pass/fail.

seconductor ai vision inspection

Pattern defect inspection

Precisely detects fine pattern defects generated during the photolithography process using deep learning vision inspection.

seconductor ai vision inspection

Wafer surface defect inspection

Identifies defect areas on the wafer surface to determine pass/fail.

Packaging

Accurately identify defects and microcracks using high-resolution imaging, improving yield while minimizing both overkill and underkill.

Packaging

Accurately identify defects and microcracks using high-resolution imaging, improving yield while minimizing both overkill and underkill.

seconductor ai vision inspection

Chip pattern defect detection

Determines pass/fail for semiconductor patterns and classifies defect types

seconductor ai vision inspection

Between-chip scribe line inspection

At the semiconductor chip-level inspection stage, inspections are carried out using specialized inspection equipment (AVI).

seconductor ai vision inspection

Solder bump defect inspection

Inspects solder bumps, the microscopic metal balls formed on the chip surface, using AOI inspection equipment.

seconductor ai vision inspection

Chip pattern defect detection

Determines pass/fail for semiconductor patterns and classifies defect types

seconductor ai vision inspection

Solder bump defect inspection

Inspects solder bumps, the microscopic metal balls formed on the chip surface, using AOI inspection equipment.

seconductor ai vision inspection

Between-chip scribe line inspection

At the semiconductor chip-level inspection stage, inspections are carried out using specialized inspection equipment (AVI).

Main features

Key advantages of Neurocle's semiconductor vision inspection

Accurate microdefect detection

Neurocle's deep learning technology accurately captures subtle differences between normal patterns and defects, detecting fine defects that traditional inspection methods easily overlook.

Accurate microdefect detection

Neurocle's deep learning technology accurately captures subtle differences between normal patterns and defects, detecting fine defects that traditional inspection methods easily overlook.

Accurate microdefect detection

Neurocle's deep learning technology accurately captures subtle differences between normal patterns and defects, detecting fine defects that traditional inspection methods easily overlook.

Precise detection even with high-resolution images

Build inspection models with original high-resolution images without resizing to detect defects without any information loss

Precise detection even with high-resolution images

Build inspection models with original high-resolution images without resizing to detect defects without any information loss

Precise detection even with high-resolution images

Build inspection models with original high-resolution images without resizing to detect defects without any information loss